3D PLUS

3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and bare die and wafer level stacking technology meeting the demand for high reliability, high performance and very small size of today's and tomorrow's electronics. Its patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and, enables stacking heterogeneous active, passive and Opto-electronics devices in a single highly miniaturized package. Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components. It responds to a diverse range of needs and requirements going from low volume-space qualified up to high volume-industrial applications. Benefiting from high Quality standards based on the ISO9001 certification, our 3D stacking technology is the sole worldwide qualified by the European Space Agency (ESA) and the French Space Agency (CNES) for Space applications. 3D PLUS standard products and System-In-Package (SiP) solutions are used in high technology industries for industrial, computer boards & embedded systems, defense & security, aircrafts & avionics, medical & sciences and aerospace applications.