Advanced Dicing Technologies

Advanced Dicing Technologies Inc. specializes in the development and manufacturing of systems, blades, and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). The companys products include dicing saws, laser scribing systems, dicing blades & flanges, dicing tools & accessories, and wafer mounting & cleaning stations. The company was established in 2003 and is based in Yokneam, Israel.