Amicra Microtechnologies

AMICRA Microtechnologies GmbH, a worldwide leading supplier of ultra-precise die bonding equipment, founded in 2001 and headquartered in Regensburg, Germany, provides leading-edge products and engineering services for back-end manufacturing and packaging processes to customers in multiple segments of the electronics industry such as Photonic Integrated Circuits, Active Optical Cable, High Power Laser, WLP, Fan-out, TSV, TCB, Optical Device Packaging, LED and MEMS . With its latest micro-assembly solutions supporting, flip-chip, die-attach and eutectic die-attach AMICRA has optimized traditional bond processes in terms of high precision die placement accuracy. AMICRA maintains a global sales and support network with representative offices throughout Europe, Israel, Asia Pacific and China, as well as North America.