TEAM PACIFIC

For almost 3 decades, TEAM Pacific Corporation has been providing Semiconductor Assembly and Test (SAT) services to its expanding clientele. In line with our goal to further expand in the worldwide market, we are making a stop at the INTERNEPCON 2013, Asia's biggest Semiconductor Exhibit. We will leverage on the event's noteworthy scale to introduce our latest packaging capabilities: VPMPs or Versatile Power Module Packages. To quote our VP for Marketing, Ms. Louie Meraña, "We recognize the potential of the Asian economy, and we want to take part in it. This event will strengthen our place in the Asian market as well as the rest of the world. It will also be a good venue to highlight our new packaging capabilities, VPMPs." TEAM's VPMPs (Versatile Power Module Packages) are an open tool ideal for high power applications that feature readiness for assembly. They are versatile in that a package can house a diversified number of circuits. Our R&D and other key personnel will be at Tokyo Big Sight, Japan, Booth number East 46-35 , to entertain questions and engage in technical discussions regarding these packages.