TFME

TFME provide customers with a full range of test platforms and engineering services to support a wide range of analog and mixed signal, automotive, Radio Frequency (RF), high-performance digital semiconductor devices, baseband and application specific integrated circuits. With the additional of TF-AMD, our test portfolio includes, CPU, GPU, gaming console and high performance networking products. Our full turnkey solutions designed to be faster time to market, which include wafer bump services, probe, final test and post-test services delivering the lowest cost of test to our customers and faster time-to-market. TFME advanced probe and inspection services supports known good die (KGD) binning, thin wafers, high volume devices with both soft dock and direct docking for sensitive devices.