Chipbond

About Chipbond: Founded in 1997 by semiconductor industry veterans, Chipbond Technology was the early pioneer in providing wafer-bumping services to Taiwan, and has been growing at a steady pace to become a technology leader in the industry. Located in Taiwan's Hsin-chu Science-Based Industrial Park. Both gold bumping and solder bumping services are available for customers' advanced packaging technology requirements. In addition to wafer bumping, Chipbond is also providing tape carrier packaging (TPC) and chip on glass (COG) turnkey solutions especially targeted toward a range of display driver ICs.